Metal working – Method of mechanical manufacture – Assembling or joining
Patent
1981-08-03
1983-08-09
Krawczewicz, Stanley T.
Metal working
Method of mechanical manufacture
Assembling or joining
29578, 324 61R, H01L 2166, H01L 2168
Patent
active
043970788
ABSTRACT:
On a mask to be used in fabrication of semiconductor integrated circuits is formed an electrode outside of an integrated circuit pattern area with the same material as said pattern area in the same thickness as said pattern area, this mask is positioned above a wafer as separated therefrom at a minute gap distance, and the gap distance between the mask and the wafer is measured by detecting an electrostatic capacitance between the electrode and the wafer.
REFERENCES:
patent: 3815020 (1974-06-01), Mayer
patent: 3843924 (1974-10-01), Wahlgren
Colclaser: "Microelectronics: Processing and Device Design"-John Wiley, pp. 41-43-1982.
Krawczewicz Stanley T.
Solis Jose M.
Telmec Co., Ltd.
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