Method and apparatus for measuring a depth of holes in...

Gear cutting – milling – or planing – Milling – Process

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C409S188000, C409S190000, C409S200000, C408S0010BD, C408S124000, C340S680000

Reexamination Certificate

active

10559640

ABSTRACT:
A method and apparatus for measuring a hole depth in a composite-material workpiece machined by a orbital cutting tool, including the steps of applying a low-level electric potential to an electrically insulated cutting tool having a cutting head with radial and axial cutting edges and with a predetermined axial length; determining a first zero reference position as the cutting tool initially contacts a first surface of the workpiece and closes an electric circuit through the grounded workpiece; and detecting a second reference position when the cutting head penetrates an opposite, second surface of the workpiece. The finished hole depth is determined by deducting the predetermined axial length of the cutting head from the total length of axial advancement from the first zero reference position to the second reference position. The orbital machining apparatus includes ceramic bearings electrically insulating the spindle and the cutting tool from surrounding components of the apparatus.

REFERENCES:
patent: 4397188 (1983-08-01), Bansevichus et al.
patent: 4451892 (1984-05-01), McMurtry
patent: 4644335 (1987-02-01), Wen
patent: 4657451 (1987-04-01), Tanaka
patent: 4765784 (1988-08-01), Karwan
patent: 5123789 (1992-06-01), Ohtani et al.
patent: 5139376 (1992-08-01), Pumphrey
patent: 5663504 (1997-09-01), Kluft
patent: 5688160 (1997-11-01), Pozzetti et al.
patent: 5971678 (1999-10-01), Linderholm
patent: 6309151 (2001-10-01), Sacchetti
patent: 6382890 (2002-05-01), Linderholm
patent: 6663327 (2003-12-01), Linderholm et al.
patent: 32 06 354 (1982-02-01), None
patent: 43 40 249 (1993-11-01), None
patent: 100 56 184 (2000-11-01), None
patent: A 9003587-4 (1990-11-01), None
patent: WO 01/15870 (2001-03-01), None
patent: WO 03/008136 (2003-01-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for measuring a depth of holes in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for measuring a depth of holes in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for measuring a depth of holes in... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3913212

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.