Semiconductor device manufacturing: process – With measuring or testing
Patent
1997-03-06
1998-09-01
Dang, Thi
Semiconductor device manufacturing: process
With measuring or testing
438692, 156345, 451287, B24D 1700, H01L 2100
Patent
active
058010661
ABSTRACT:
The inventive apparatus is a wafer planarizer that has a movable platen, a polishing pad positioned on the platen, a wafer carrier positioned opposite the polishing pad, and a measuring device that is engagable with the polishing pad. The polishing pad decreases as the wafer is conditioned in a straight line correlation with the resulting polishing rate of a wafer. The wafer is attachable to the wafer carrier, and it may be moved with the carrier to be selectively engaged with the polishing pad to planarize the wafer at a wafer polishing rate under a set of wafer polishing operating parameters. After the wafer is planarized, the pad is conditioned by removing a layer of material from the planarizing surface of the pad under a set of conditioning parameters. The measuring device measures the decrease in the thickness of the polishing pad after the pad is conditioned, and it correlates the actual decrease in pad thickness with an expected change in pad thickness. When the same pad conditioning parameters are used from one pad conditioning cycle to the next, a difference between the actual decrease in pad thickness and the expected change in pad thickness indicates a change in operating parameters.
REFERENCES:
patent: 2662519 (1953-12-01), Metzger
patent: 3090171 (1963-05-01), Stimson
patent: 4200395 (1980-04-01), Smith et al.
patent: 4203799 (1980-05-01), Sugawara et al.
patent: 4358338 (1982-11-01), Downey et al.
patent: 4367044 (1983-01-01), Booth, Jr. et al.
patent: 4377028 (1983-03-01), Imahashi
patent: 4422764 (1983-12-01), Eastman
patent: 4513538 (1985-04-01), Wolters et al.
patent: 4640002 (1987-02-01), Phillips et al.
patent: 4660980 (1987-04-01), Takabayashi et al.
patent: 4879258 (1989-11-01), Fisher
patent: 5036015 (1991-07-01), Sandhu et al.
patent: 5069002 (1991-12-01), Sandhu et al.
patent: 5081051 (1992-01-01), Mattingly et al.
patent: 5216843 (1993-06-01), Breivogel et al.
patent: 5220405 (1993-06-01), Barbee et al.
patent: 5232875 (1993-08-01), Tuttle et al.
patent: 5272117 (1993-12-01), Roth et al.
patent: 5297365 (1994-03-01), Nishioka et al.
patent: 5324381 (1994-06-01), Nishiguchi
patent: 5384986 (1995-01-01), Hirose et al.
patent: 5456627 (1995-10-01), Jackson et al.
patent: 5461007 (1995-10-01), Kobayashi
patent: 5483568 (1996-01-01), Yano et al.
patent: 5486131 (1996-01-01), Cesna et al.
patent: 5531635 (1996-07-01), Mogi et al.
Dang Thi
Micro)n Technology, Inc.
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