Coating processes – Nonuniform coating
Patent
1990-03-15
1992-05-05
Lawrence, Evan
Coating processes
Nonuniform coating
427294, 118 50, 118500, 134902, B05D 500, B05C 1302, B08B 1102
Patent
active
051106280
ABSTRACT:
A method and apparatus for marking or erasing a marking on a semiconductor chip package having leads. The apparatus comprises a circular disk has many pockets on one surface near its circumference suitable for holding semiconductor chips. Each pocket has a pedestal rising from the bottom of the pocket and suitable for supporting the bottom portion of a semiconductor chip package. The edges of the pocket and the pedestal define between them space suitable for housing the leads of the package. The pedestal has a hole therein which can be evacuated so that the package is held to the pedestal by atmospheric pressure so that the top surface of the package may be marked or in marking thereon can be erased. Thus the package is held to the pedestal by sufficient force for the marking or erasing process. The leads of the package are therefore not bent or otherwise disturbed. Rotation of the disk allows the packages to be sequentially marked or erased.
REFERENCES:
patent: 3538883 (1970-11-01), Polin
patent: 3675563 (1972-07-01), Metreaud
patent: 4418639 (1983-12-01), Wills et al.
patent: 4594263 (1986-06-01), Folk et al.
patent: 4938994 (1990-07-01), Choinski
patent: 4959246 (1990-09-01), Cleemput
Jorgensen, R. R., et al., "Wafer Angular Alignment Detection and Positioning System", IBM TDB, vol. 14, No. 11, Apr. 1972, pp. 3239-3242.
Ganapol David L.
Small Gary L.
Lawrence Evan
VLSI Technology Inc.
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