Method and apparatus for manufacturing semiconductor wafers and

Details Method and apparatus for manufacturing semiconductor wafers and Method and apparatus for manufacturing semiconductor wafers and

1989-02-16

1990-11-06

Schmidt, Frederick R.

Stone working

Sawing

Endless

51135R, 836511, 83661, B28D 108

Patent

active

049677250

ABSTRACT:
Wafers are manufactured from an ingot of semiconductor material by first machining a front face of the ingot to provide a substantially planar reference surface and then slicing the ingot using looped cutting wire apparatus. The cutting wire apparatus includes a looped cutting wire and at least two drive rollers over sectors of which the cutting wire is wrapped. Each drive roller is provided with its own drive motor which has shunt motor characteristics. The speed and torque of each motor is adjustable relative to the load applied to its drive roller by the cutting wire such that all of the drive rollers participate in driving the cutting wire with substantially the same reliability against slippage so that wear is distributed uniformly over all of the drive rollers.

REFERENCES:
patent: 3155087 (1964-11-01), Dreyfus
patent: 3824982 (1974-07-01), Bowman
patent: 4484502 (1984-11-01), Ebner

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