Method and apparatus for manufacturing semiconductor device

Details Method and apparatus for manufacturing semiconductor device Method and apparatus for manufacturing semiconductor device

1995-12-08

1998-03-10

Tsai, Jey

Semiconductor device manufacturing: process

Including control responsive to sensed condition

Electrical characteristic sensed

H01L 2100

Patent

active

057260745

ABSTRACT:
In a method and an apparatus for manufacturing a semiconductor integrated circuit, including a wafer test process, an assembling process and a sorting process, electric characteristics of a plurality of semiconductor integrated circuits formed on a wafer, is measured, and then stored in a memory means together with data of the position of each semiconductor integrated circuit. The plurality of semiconductor integrated circuits on the wafer are cut into individual semiconductor integrated circuit chips. On the basis of the position data and the electric characteristics of each of the semiconductor integrated circuit chips read from the memory means, the semiconductor integrated circuit chips are classified into at least two subsets each consisting of non-defective semiconductor integrated circuit chips having the same electric characteristics different from that of products included in the other subset, and the non-defective semiconductor integrated circuit chips included in each of the at least two subsets, are packaged for each of the at least two subsets, so that the sorting is simultaneously carried out.

REFERENCES:
patent: 5219765 (1993-06-01), Yoshida et al.
patent: 5240866 (1993-08-01), Friedman et al.
patent: 5256578 (1993-10-01), Corley et al.
patent: 5350715 (1994-09-01), Lee

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