Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Patent
1986-08-18
1988-04-26
Epstein, Henry F.
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
5470, 156196, 428 71, 428 76, B32B 518
Patent
active
047402601
ABSTRACT:
The method and apparatus for forming at least a portion of a seat wherein an envelope cover comprising a generally tubular shape fabric member having an open end and inner and outer sides is positioned on a cantilever supported forming tool so as to shape at least a portion of the outer side to a desired shape. A foam pad which has been molded to a shape conforming to the predetermined shape of the cover is then positioned in firm surface-to-surface engagement with the shaped cover portion and secured by glue thereto. The envelope can then be removed from the cantilever supported forming tool with the foamed pad adhered thereto and then turned inside out and assembled with a seat frame to provide a desired portion of a seat. This eliminates the need for fasteners or hard plastic back panels in the seat portion.
REFERENCES:
patent: 1156939 (1915-10-01), Smith
patent: 3318636 (1967-05-01), Callum
patent: 3361610 (1968-01-01), Hannes
patent: 3389411 (1968-06-01), Emery
patent: 4493877 (1985-01-01), Burnett
patent: 4537646 (1985-08-01), Hoyle
patent: 4557790 (1985-12-01), Wisbey
patent: 4579764 (1986-04-01), Peoples, Jr. et al.
patent: 4592345 (1986-06-01), Wahl
Selbert Alan J.
Witzke Duane W.
Zeilinger Randy A.
Epstein Henry F.
Johnson Service Company
LandOfFree
Method and apparatus for manufacturing seats and article formed does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for manufacturing seats and article formed , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for manufacturing seats and article formed will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-817999