Method and apparatus for manufacturing preform panels with prefo

Cutting – Processes – Plural cutting steps

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83 55, 83140, 83207, 83238, 83278, B21D 2810, H05K 324

Patent

active

050054554

ABSTRACT:
A method and apparatus for manufacturing preform panels having at least one preform for repairing interconnects, particularly for repairing meander-like interconnects with a preform plated with hard solder. The metal has at least the steps of: providing at least two successive punch events with a die; and performing a predetermined feed (V) between a metal band and the die between the two punch events, whereby the length of the feed (V) is greater than a die width of the die, a length of the die being shorter than a width of the metal band, and the preform being formed by a residual web of the metal band after the two successive punch events. The apparatus for manufacturing preform panels having at least one preform from a metal band has at best: a receptacle plate on a carriage for the acceptance of the metal band; a die with a means for hold-down; a motor for generating a predetermined feed between the die and the metal band; at least two positioning pins for positioning the metal band on the receptacle plate; and a die-plate that cooperates with the die that is perpendicularly movable up and down and with its hold-down means.

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"Open Conductor Repair for Glass Metal Module" by F. M. Tappen, IBM Technical Disclosure Bulletin, vol. 14, No. 10, Mar. 1972, p. 2915.

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