Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2007-03-06
2007-03-06
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S825000, C029S832000, C156S089110, C156S089150, C156S089170
Reexamination Certificate
active
10049499
ABSTRACT:
The present invention has an object to provide a producing method and producing apparatus of multilayered printed-circuit board that has eliminated the resin flow and resolved the problems of board thickness discrepancy and misregistration.A producing method of multilayered printed-circuit board, comprising steps of stacking up a laminated sheet covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer and, thereafter, setting the prepreg by pressurizing/heating, wherein, before conducting the pressurizing/heating, gas is sprayed to the surface of the laminated shoot covered with conductive foil or conductor for outer layer, a prepreg and a laminated sheet covered with conductor for inner layer to eliminate impurities from the surface.
REFERENCES:
patent: 5683529 (1997-11-01), Makihara et al.
patent: 5685327 (1997-11-01), Mohindra et al.
patent: 5735451 (1998-04-01), Mori et al.
patent: 3-296479 (1991-12-01), None
patent: 5-261718 (1993-10-01), None
patent: 11-20113 (1999-01-01), None
Murakami Hidetoshi
Ohmi Tadahiro
Arbes Carl J.
Kabushiki Kaisha Daishodenshi
Ohmi Tadahiro
Young & Thompson
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