Metal working – Method of mechanical manufacture – Electrical device making
Patent
1994-11-14
1997-06-03
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
29832, 324755, 324765, 438 16, 438 17, H05K 334
Patent
active
056342675
ABSTRACT:
A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die. In the assembled carrier the die and interconnect are biased together by a force distribution mechanism that includes a bridge clamp, a pressure plate and a spring clip. Following testing of the die, the carrier is disassembled and the tested die is removed.
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Farnworth Warren
Wood Alan
Arbes Carl J.
Gratton Stephen A.
Micro)n Technology, Inc.
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