Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2004-12-22
2009-02-10
Thai, Luan C (Department: 2891)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S106000, C257S679000, C340S572700, C365S149000, C029S740000
Reexamination Certificate
active
07488619
ABSTRACT:
A film substrate that has antenna circuits formed at a fixed spacing on one surface thereof is transported at a constant speed, and IC chips are moved along the film substrate, and are mounted at the fixed spacing on the film substrate so as to be connected to the antenna circuits.
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Arima Sumihiro
Inoue Taichi
Morita Masashi
Nagano Kazutaka
Darby & Darby PC
Shinko Electric Co. Ltd.
Thai Luan C
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