Method and apparatus for manufacturing IC chip packaged device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...

Reexamination Certificate

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Details

C438S106000, C257S679000, C340S572700, C365S149000, C029S740000

Reexamination Certificate

active

07488619

ABSTRACT:
A film substrate that has antenna circuits formed at a fixed spacing on one surface thereof is transported at a constant speed, and IC chips are moved along the film substrate, and are mounted at the fixed spacing on the film substrate so as to be connected to the antenna circuits.

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