Food or edible material: processes – compositions – and products – Assembling plural edible preforms having extraneous binder,... – Dough is preform
Reexamination Certificate
1998-11-17
2001-02-20
Cano, Milton (Department: 1761)
Food or edible material: processes, compositions, and products
Assembling plural edible preforms having extraneous binder,...
Dough is preform
C426S089000, C426S094000, C426S144000, C099S450400
Reexamination Certificate
active
06190714
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to the production of filled wafers. Filled wafers are for instance large, basically rectangular wafer blocks with a short height in relation to their size, which are bordered on their upper and lower sides respectively by a flat, rectangular wafer sheet and/or by a rectangular wafer sheet provided with bulges, and are filled with a spread between the wafer sheets The large filled wafer blocks are divided into small filled wafers in the form of either small rectangular wafer pieces, or small filled hollow wafers each corresponding to a bulge in the wafer block.
STATE OF THE ART
In the baked goods, wafer and sweets field large basically rectangular filled wafer blocks, with a short height in relation to their size are known. They consist of large wafer sheets, thin in relation to their size, and layers of spread between the wafer sheets. These wafer blocks are bordered respectively on their upper side by an uppermost wafer sheet and on their bottom side by a lowermost wafer sheet. These wafer blocks are divided into small rectangular wafer pieces or into small hollow bodies, each corresponding to a bulge.
The wafer blocks subsequently mentioned as “flat wafer blocks” each contain two or more flat rectangular wafer sheets and one or more layers of spread. The height of these wafer blocks corresponds to the height of the small filled wafer pieces to be produced therefrom. The length and width of these wafer blocks correspond to a multiple of the length and width of the small filled wafer pieces.
The wafer blocks subsequently mentioned as “wafer blocks provided with bulges” are also defined as so-called “filled hollow wafer blocks”. In these wafer blocks, two flat rectangular wafer sheets, at least one of which has projecting bulges on its back side, are connected with each other at their frontal sides with a spread layer. Between the two wafer sheets there are hollow spaces corresponding to the bulges, which are defined by two opposite partial areas of the wafer sheets and are at least partially filled with the spread. Each wafer block provided with bulges contains several small, adjacent and laterally interconnected hollow bodies. Each of these hollow bodies consists of two parts, which complement each other in forming the configuration of the respective hollow body and are formed by opposite partial areas of the wafer sheets. The configuration of each of these body parts corresponds to the configuration of the respective partial area of the wafer sheet, which is either flat or provided with bulges. The filled hollow wafer block is divided between its bulges into small filled hollow wafers, each of them comprising a single hollow body at least partially filled with the spread and has an outer shell made of baked wafer dough. The outer shape of these small hollow bodies or of these small hollow wafers, can be for instance spherical or a hemispherical, cylindrical, cubical, acorn-shaped, walnut-shaped, hazelnut-shaped, praline-shaped, etc.
The small filled wafer pieces and the small filled hollow bodies are produced in industrial quantities on continuously working production lines which are set up for the respective final product. The large rectangular wafer blocks are an intermediate product which is manufactured in a sandwiching machine from spread and rectangular wafer sheets. In the respective production line the wafer blocks are chilled for hardening and later divided into small filled wafer pieces or into small filled hollow bodies.
The rectangular wafer sheets are produced in continuously operating automatic wafer-baking machines, whose maximal production capacity corresponds to a multiple of the processing capacity of the known sandwiching machines. The wafer sheets which are produced in the wafer-baking oven or the automatic wafer-baking machine, from a fluid wafer dough consisting mainly of wheat flour and water, are cooled in the respective production line or left to cool, and then transported to a cream-spreading device and further to the sandwiching machine. The wafer sheets have a crunchy, rough and slightly breakable consistency and a humidity content of a maximum 1-4% by weight.
In the production of large two-layer wafer blocks having bulges on the upper and the lower side it is known to transport the wafer sheets lying down in a transport device to a sandwiching machine, wherein the coated wafer sheets are folded together in pairs with their coated sides facing each other, thereby forming two-layer wafer blocks, which are deposited on a transport device and carried away by the same. The known sandwiching machine consists of a folding device arranged below the transportation plane of the transport device, whose folding elements lift the two wafer sheets of a wafer block from the transport device and swing them towards each other above the transport device. After the block formation, the folding elements are again swung apart, thereby depositing the wafer block on the transport device. The wafer block is carried away, out of the operating range of the folding device and its folding elements are lowered below the transport level. When the operation zone of the of the folding device is free again, the two wafer sheets of the next wafer block are transported within the operating range of the folding device and stopped there. Then the folding device is again set into action and the next wafer block is formed. The working rhythm of the folding device and the pauses between two successive block formations are attuned to the intermittent supply of the wafer sheets in pairs and are influenced by the size of the respective wafer sheets and by the weight and consistency of the spread layers. In order to keep within limits the effect of the mass inertia forces, generated while the wafer sheets are folded together, on the wafer sheets and their spread layers, the speed at which the folding elements move is increasingly reduced with the increasing size of the wafer sheets and the increasing weight of the spread layers, which necessarily leads to a longer work cycle of the folding device and to longer pauses between successive block formations. Therefore the production capacity which can be achieved in the processing of wafer sheets into wafer blocks with the sandwiching machine designed as a folding device decreases with the increasing size of the wafer sheets and the increasing weight of the spread layers. Multiple-layer blocks can not be produced with a sandwiching machine based on a folding device.
In the production of large, flat wafer blocks with two or several layers it is known to feed the flat wafer sheets to a sandwiching device wherein the wafer sheets arriving one after the other on a lower level are individually lifted to a higher level, and formed into a block on its upper side, which is carried away from the upper side of the sandwiching device and subsequently is calibrated to a predetermined height. This sandwiching machine lifts each coated wafer sheet from a lower level and presses it from underneath with it coated upper surface against the uncoated bottom side of a wafer sheet located in the upper level. In the sandwiching device, each wafer sheet lies on curved holding members, moving from the lower level to the upper level, which are made of segments, projecting into the travel path of the wafer sheets, of two wire-like helical path rotating in countersense, whose axes of rotation lie outside the travel path of the wafer sheets. The curved holding members press from underneath against the bottom side of the wafer sheet and support the same only linearly. In this sandwiching device, the diameters and the mutual distance of the wire-like helical tracks are adjusted to the format of the wafer sheets and increase with the increasing size of the wafer sheets. In the case of large wafer sheets and heavy spread layers, this leads to increasing breaking danger for the coated wafer sheets during block formation.
In the wafer baking ovens wherein the wafer sheets are produced, the trend is towards larger and larger formats
Haas Franz
Haas Johann
Koletnik Erich
Cano Milton
Dubno Herbert
Franz Haas Waffelmaschinen-Industrie Aktiengesellschaft
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