Method and apparatus for manufacturing electronic integrated...

Details Method and apparatus for manufacturing electronic integrated... Method and apparatus for manufacturing electronic integrated...

2011-06-21

2011-06-21

Luu, Chuong A. (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S118000, C438S125000, C438S109000

Reexamination Certificate

active

07964444

ABSTRACT:
A method (and apparatus) of assembling a die on an electronic substrate, includes processing an assembly including a substrate and a die, and during the processing, introducing a pre-stress to the assembly during a cure process.

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patent: 7585693 (2009-09-01), Frutschy et al.
patent: 7759220 (2010-07-01), Henley
patent: 2008/0079166 (2008-04-01), Lee et al.
patent: 2008/0315389 (2008-12-01), Nunn

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