Method and apparatus for manufacturing diamond shaped chips

Details Method and apparatus for manufacturing diamond shaped chips Method and apparatus for manufacturing diamond shaped chips

2007-10-30

2007-10-30

Dang, Duy M. (Department: 2624)

Image analysis

Applications

Manufacturing or product inspection

C382S151000

Reexamination Certificate

active

10250295

ABSTRACT:
In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.

REFERENCES:
patent: 5055871 (1991-10-01), Pasch
patent: 0583625 (1994-02-01), None

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