Image analysis – Applications – Manufacturing or product inspection
Reexamination Certificate
2011-06-14
2011-06-14
Dang, Duy M (Department: 2624)
Image analysis
Applications
Manufacturing or product inspection
Reexamination Certificate
active
07961932
ABSTRACT:
In a first aspect, an inventive apparatus for imaging a chip on a wafer includes a combined diamond chip image and kerf image having a plurality of sloped sides. The combined diamond chip image and kerf image includes a diamond chip image comprising a plurality of chip image rows that are parallel to at least one diagonal of the diamond chip image, and includes a kerf image adjacent to the diamond chip image. The kerf image comprises at least one kerf image row that is parallel to the at least one diagonal of the diamond chip image. The apparatus further includes a blocking material extending from the combined diamond chip image and kerf image to at least a periphery of an exposure field of a stepper. In a second aspect the imaging apparatus comprises an n-sided polygon-shaped combined chip image and kerf image. Also provided are inventive methods of manufacturing chips, and wafers manufactured in accordance with the inventive methods.
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Allen Robert J.
Cohn John M.
Gould Scott W.
Habitz Peter A.
Koehl Juergen
Dang Duy M
Dugan & Dugan P.C.
International Business Machines - Corporation
LeStrange Michael J.
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