Method and apparatus for manufacturing a transistor-outline...

Details Method and apparatus for manufacturing a transistor-outline... Method and apparatus for manufacturing a transistor-outline...

2007-05-29

2007-05-29

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S125000

Reexamination Certificate

active

10732949

ABSTRACT:
A method of manufacturing an optoelectronic packaging comprises placing a solder preform between a metal cover and an insulating base, applying pressure to the metal cover and the insulating base, and applying a current through multiple conductive vias to heat the solder preform to melt.

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patent: 2004/0114882 (2004-06-01), Marquez et al.

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