Method and apparatus for manufacturing a transistor-outline...

Optical waveguides – With disengagable mechanical connector – Optical fiber to a nonfiber optical device connector

Reexamination Certificate

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C385S147000

Reexamination Certificate

active

10732929

ABSTRACT:
An optoelectronic package includes an insulating base and an optoelectronic device mounted on the upper surface of the insulating base. A metal layer is attached to the upper surface of the insulating base, and a metal cap is attached to the metal layer to hermetically seal the metal cap to the insulating base. In one embodiment, the metal cap is projection welded to the metal layer.

REFERENCES:
patent: 6555399 (2003-04-01), Wood et al.
patent: 6860652 (2005-03-01), Narayan et al.
patent: 6948863 (2005-09-01), Ito et al.
patent: 2004/0021217 (2004-02-01), Epitaux et al.
patent: 2004/0240803 (2004-12-01), Rechberger et al.

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