Metal fusion bonding – Process – With clamping or holding
Patent
1994-05-25
1995-05-30
Heinrich, Samuel M.
Metal fusion bonding
Process
With clamping or holding
22818021, 29829, 29831, B23K 3102
Patent
active
054194830
ABSTRACT:
Assembling a circuit card to a straddle mount connector with improved alignment. A holder using a parallel linkage holds the card parallel to the connector despite thickness variations, during solder bonding.
REFERENCES:
patent: 3939382 (1976-02-01), Lacan et al.
patent: 4167032 (1979-09-01), Scagnelli
patent: 4403408 (1983-09-01), Koppensteiner et al.
patent: 4872853 (1989-10-01), Webster
patent: 5013264 (1991-05-01), Tondreault
patent: 5067648 (1991-11-01), Cascini
Becker Darryl J.
Hanson Brian B.
Hora Donald E.
Peacock James L.
Anglin J. Michael
Heinrich Samuel M.
International Business Machines - Corporation
LandOfFree
Method and apparatus for manufacturing a printed circuit card an does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for manufacturing a printed circuit card an, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for manufacturing a printed circuit card an will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-356952