Method and apparatus for manufacturing a filament served bondabl

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156 53, 427118, 427425, 427432, 427433, H01F 4106

Patent

active

042311519

ABSTRACT:
A filament served bondable conductor is described. A metal wire is wrapped with an insulating yarn then suspended between two supports. After passing over the first support, the wire is immersed in a varnish, excess varnish is removed, and the varnish is cured in an oven before the wire passes over the second support. The wire is again suspended between two more supports. After passing over the third support the wire is immersed in an enamel, excess enamel is removed, and the enamel is cured to a non-tacky B-stage in the same oven. The wire can then be wound on a take-up reel until needed. The wire can be formed into coils and the coils heated to fuse and completely cure the enamel.

REFERENCES:
patent: 2504845 (1950-04-01), Keyes
patent: 2935631 (1960-05-01), Jones
patent: 3027287 (1962-03-01), Hammer et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method and apparatus for manufacturing a filament served bondabl does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for manufacturing a filament served bondabl, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for manufacturing a filament served bondabl will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1638386

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.