Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having a perfecting coating
Reexamination Certificate
2006-02-21
2006-02-21
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
Semiconductor substrate dicing
Having a perfecting coating
Reexamination Certificate
active
07001828
ABSTRACT:
In a method for manufacturing a device having a moveable structure a substrate is processed in order to obtain intermediate devices on the substrate, wherein an intermediate device comprises the moveable structure and a protective structure protecting the moveable structure. The substrate is diced in order to obtain a diced intermediate device comprising the protective structure. Subsequently, the protective structure is removed from the diced intermediate device in order to obtain the device. An apparatus for manufacturing a device includes means for performing the method steps.
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Barzen Stefan
Dehé Alfons
Infineon - Technologies AG
Slater & Matsil L.L.P.
Smith Matthew
Tobergte Nicholas
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