Metal working – Method of mechanical manufacture – Electrical device making
Patent
1993-10-26
1995-03-07
Arbes, Carl J.
Metal working
Method of mechanical manufacture
Electrical device making
22818021, 22818022, H05K 334
Patent
active
053946090
ABSTRACT:
Disclosed is a method of populating printed circuit boards with surface mount technology devices in a multi-board work board holder. The method includes the steps placing the printed circuit boards into a multi-board work board holder having a plurality of apertures corresponding to the individual printed circuit boards. The multi-board work board holder is placed onto a surface mount technology production line, and solder paste is selectively applied onto contact pads on surfaces of the printed circuit boards. Integrated circuit chips are next placed onto the solder paste bearing surface of the printed circuit boards, with the contact leads of the integrated circuit chips bearing on deposited solder paste. The printed circuit boards and the work board holder are heated to the reflow temperature of the solder. The x-y plane and z axis coefficients of thermal expansion of the multi-board work board holder are matched to the x-y plane and z-axis coefficients of thermal expansion of the printed circuit boards to avoid warpage and misalignment of the printed circuit boards.
REFERENCES:
patent: 4582245 (1986-04-01), Cartwright
patent: 4779877 (1988-10-01), Shaw
patent: 4860439 (1989-08-01), Riley
IBM Technical Disclosure Bulletin vol. 19 No. 4 Sep. 1976, pp. 1178-1179 by V. D. Coombs et al.
IBM Technical Disclosure Bulletin vol. 26 No. 11 Apr. 1984 "Workpiece Holder", R. H. Hagen, R. E. Koppstein and R. J. Reis, pp. 6128-6129.
27535 "Workboard Holder For Flexible Circuitry" Disclosed anonymously, Reproduced by Research Disclosure, Mar. 1987, No. 275.
IBM Technical Disclosure Bulletin vol. 17 No. 1 Jun. 1974 "Wafer Chuck", R. H. Brunner, p. 84.
IBM Technical Disclosure Bulletin vol. 20 No. 3 Aug. 1977 "Heat Sinking Wafer Gripper" G. M. Greenstein and F. Simms, p. 949.
Ferguson Mark E.
Guskie Kenneth J.
Nguyen Leon S.
Poole Joseph D.
Young Stuart L.
Arbes Carl J.
Goldman Richard M.
International Business Machines - Corporation
LandOfFree
Method and apparatus for manufacture of printed circuit cards does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for manufacture of printed circuit cards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for manufacture of printed circuit cards will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1398805