Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2008-01-15
2008-01-15
Smith, Matthew (Department: 2823)
Semiconductor device manufacturing: process
With measuring or testing
Packaging or treatment of packaged semiconductor
C438S112000, C438S125000, C438S127000, C257SE21504, C257SE23124, C257S787000
Reexamination Certificate
active
10313033
ABSTRACT:
A semiconductor device is manufactured in such a way that a semiconductor chip connected with leads whose internal ends are interconnected with bonding wires are completely sealed and enclosed in a resin corresponding to a package while external ends of leads are exposed from the surface of the package. In manufacture, a chip fixing member is used to fix the semiconductor chip in a prescribed position, while wire fixing members are used to fix the bonding wires in prescribed positions. Both the fixing members are retracted into the split mold so as to avoid formation of unfilled portions or voids in the resin in the cavity. In inspection, an electrical conduction is detected between the bonding wire(s) and an electrode layer formed inside of the cavity, so that a semiconductor device produced in the cavity is automatically removed from the manufacturing line.
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Dickstein & Shapiro LLP
Smith Matthew
Stark Jarrett J
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