Method and apparatus for manipulating a microscopic sample

Details Method and apparatus for manipulating a microscopic sample Method and apparatus for manipulating a microscopic sample

2006-02-28

2006-02-28

Lee, John R. (Department: 2881)

Radiant energy

Methods including separation or nonradiant treatment of test...

C250S492210, C250S492200, C250S492100, C250S309000

Reexamination Certificate

active

07005636

ABSTRACT:
In the semiconductor industry, microscopic samples are cut out of substrates for purposes of analysis. In the case of a known method, a sample to be cut loose out of a substrate is attached to a sample carrier connected to a manipulator and the sample is cut loose from the substrate. Subsequently, the sample is fixed to a TEM grid and completely separated from the sample carrier.According to the invention, the sample carrier3is left in connection with the sample1and the sample carrier3is separated from the manipulator4. By making the sample carrier3connected to the sample1much bigger than the (microscopic) sample1, and by manipulating the sample carrier3, manipulation—with the aid of a (macroscopic) manipulator—of the microscopic sample1attached thereto becomes easier than manipulating the sample1without the sample carrier3attached thereto. In addition, a mechanical coupling between manipulator4and sample carrier3is shown, which enables a great degree of automation.

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patent: 6570170 (2003-05-01), Moore
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patent: 2004/0256555 (2004-12-01), Shichi et al.
patent: 2001272316 (2001-05-01), None

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