Method and apparatus for making three-dimensional objects

Details Method and apparatus for making three-dimensional objects Method and apparatus for making three-dimensional objects

1991-07-08

1992-10-20

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156196, 1562755, 156245, 156250, 156353, 156356, 1563798, 36447424, B32B 3100, G06G 764

Patent

active

051567008

ABSTRACT:
A method and apparatus for making a three-dimensional object including a large number of layers bonded together each having the contour of a thin slice of the object, are characterized in that each layer of the object is formed over its preceding layer by: applying a layer of a supporting material to the preceding layer; sculpture machining the supporting material layer according to the negative underface contour of the respective layer of the object to be formed; applying a layer of the object material in flowable form over the supporting material layer such that the underface of the object material layer takes the shape of the positive contour of the respective layer of the object to be formed; hardening the object material layer; and sculpture machining the upper face of the object material layer according to the positive upperface contour of the respective layer of the object to be formed.

REFERENCES:
patent: 4056596 (1977-11-01), Pahl
patent: 4614555 (1986-09-01), Smith et al.
patent: 4961154 (1990-10-01), Pomerantz et al.
patent: 5031120 (1991-07-01), Pomerantz et al.
patent: 5071503 (1991-12-01), Berman

Affiliated with

Also associated with

Rating

Method and apparatus for making three-dimensional objects does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for making three-dimensional objects, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for making three-dimensional objects will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-189713