Method and apparatus for making smart card solder contacts

Details Method and apparatus for making smart card solder contacts Method and apparatus for making smart card solder contacts

2005-02-22

2005-02-22

Johnson, Jonathan (Department: 1725)

Metal fusion bonding

Metallic heat applicator

With means to handle flux or filler

C228S049500, C219S056210

Reexamination Certificate

active

06857552

ABSTRACT:
A method and apparatus for soldering terminal ends of an antenna embedded in a plastic smart card to contact terminals of an IC module disposed on the card are shown. The enamel coated antenna terminal ends are pre-coated with solder with a heater having horizontal opening with melted solder retained therein. The solder pre-coated terminal ends are maintained in a secured contact with the terminal contacts of the IC module by heating coils mounted at a free front end of two pivotal elongated cantilever arms. A piece of predetermined amount of solder is dropped into the cavity of each heating coil, and the heating coils are actuated with a low electrical current to generate a concentrated intense heat to melt the piece of solder to form secure permanent solder joints between the terminal ends of the antenna to the contact terminals of the IC module.

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patent: 2003-197284 (2003-07-01), None

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