Method and apparatus for making ohmic and/or Schottky barrier co

Metal working – Method of mechanical manufacture – Electrical device making

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Details

148174, 148DIG19, 148DIG158, 148DIG22, H01L 2128

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active

045451150

ABSTRACT:
Disclosed is a method of making ohmic and/or Schottky barrier contacts to a silicon semiconductor substrate in which before depositing the metal on silicon semiconductor substrates containing integrated circuits which are covered by a mask having contact windows, the metal is initially deposited on freshly cleaned blank silicon semiconductor substrates mounted in the same vacuum chamber. In this manner any traces of oxygen present in the vacuum chamber are chemisorbed by the blank substrate resulting in deposition of a high quality oxide-free metal contacts on the device substrates.
The disclosed apparatus comprises a deposition chamber maintained at a predetermined low pressure, a substrate holder carrying a plurality of blank silicon substrates and silicon substrates containing integrated circuit structures covered by a mask having contact windows, a source of metal placed in the chamber for evaporation or sputtering and a shutter arranged in close proximity with said substrate holder for shielding selected substrates during the initial stages of metal deposition.

REFERENCES:
patent: 3274679 (1966-09-01), Lepselter
patent: 3290127 (1966-12-01), Kahng et al.
patent: 3645812 (1972-02-01), Sussmann
patent: 3893160 (1975-07-01), Botzenhardt
patent: 3906540 (1975-09-01), Hollins
patent: 3995301 (1976-11-01), Magdo
patent: 4004044 (1977-01-01), Franco et al.
patent: 4215156 (1980-07-01), Dalal et al.
Mets, "Poisoning and Gettering Effects in Si Junctions", J. of Electrochem. Soc., vol. 112, No. 4, Apr. 65.
Andersson et al., "3.5 Morphologies of rf Sputter-Deposited Solid Lubricants", Vacuum vol. 27, No. 4.
Gates, "Gettering Process of Wafer Deffects Reduction", IBM Techn. Discl. Bull., vol. 15, No. 6, Nov. '72.
IBM Technical Disclosure Bulletin, vol. 21, No. 3, Aug. 1978, "Oxygen Gettering in Transition Metals for Stable Low Barrier Height Schottky Diodes", by W-K. Chu et al., pp. 1054-1057.
IBM Technical Disclosure Bulletin, vol. 13, No. 3, Aug. 1970, "Fabricating a Gate Field-Effect Transistor", pp. 646-648, by C. J. Kitcher et al.
Journal of the Electrochemical Society, vol. 122, No. 7, Jul. 1975, "Microstructural and Electrical Properties of Thin PtSi Films and Their Relationships to Deposition Parameters", pp. 1337-1347, by R. M. Anderson et al.

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