Package making – Methods – With contents treating
Patent
1977-12-16
1980-02-26
Sipos, John
Package making
Methods
With contents treating
53435, 53460, 53117, 53520, 53206, B65B 6304, B65B 1148
Patent
active
041898958
ABSTRACT:
An envelope contains a separate enclosure that is formed from the same sheet material. Sheet material having a first portion and a narrower second portion is folded so portions are superimposed one upon the other. At some time, adhesive is applied to the wider regions of the first portion. By severing the sheet material along the edge common to the first and second portions while maintaining their superimposed relationship, they are separated and then subsequently folded so the first portion envelops the second portion, and the envelope is produced as a result of the adhesive. The severing is carried out while the superimposed portions are suitably restrained, e.g., within a buckle plate folder or within a knife-folding unit or between a pair of moving belts.
REFERENCES:
patent: 3053291 (1962-09-01), Meissner et al.
patent: 3260029 (1966-07-01), Kubick
patent: 3286435 (1966-11-01), Weinberger
patent: 3336726 (1967-08-01), Mayer et al.
patent: 3457696 (1969-07-01), Berkley
patent: 3557519 (1971-01-01), Lyon, Jr.
patent: 3593485 (1971-07-01), Stovall
patent: 3618284 (1971-11-01), Gendron
patent: 3628304 (1971-12-01), Hornung
patent: 3672703 (1972-06-01), Jay
patent: 3718277 (1973-02-01), Vorkert
patent: 3743273 (1973-07-01), Katz et al.
patent: 3845098 (1974-11-01), Schoue
patent: 3894905 (1975-07-01), Ecischeid
patent: 3998138 (1976-12-01), Walters
patent: 4039122 (1975-10-01), Johnsen
patent: 4063398 (1977-12-01), Huffman
patent: 4067171 (1978-01-01), Herbert et al.
patent: 4071997 (1978-02-01), Gunther et al.
Volkert John K.
Volkert Robert B.
Compak Systems Inc.
Sipos John
LandOfFree
Method and apparatus for making envelope assemblies does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method and apparatus for making envelope assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for making envelope assemblies will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2108263