Plastic article or earthenware shaping or treating: apparatus – Distinct means to feed – support or manipulate preform stock... – Female mold type means
Patent
1987-07-13
1989-10-10
Hoag, Willard
Plastic article or earthenware shaping or treating: apparatus
Distinct means to feed, support or manipulate preform stock...
Female mold type means
4251261, 425127, 425346, 425397, B29C 4318, B29C 4320, B29C 4334
Patent
active
048728250
ABSTRACT:
Encapsulated electronic circuit devices as well as methods and molding apparatus for making same are disclosed. For example, an integrated circuit "die" (or "chip") and the lead frame (or frames) to which it is physically affixed and electrically connected are positioned in a mold between stacks of resin impregnated fibrous layers of predetermined shape and size. The layers are then compressed under heat and pressure causing them to fuse together about the die and its lead frame(s). This forms a laminated protective sealed encapsulation for the die and adjacent portions of the lead frame(s), without causing undue damage to the delicate lead wires electrically connecting the die to the lead frame. Such multiple laminated layers of resin and fibers, which preferably include woven glass cloth or similar materials, provide a strong, resilient integrated circuit chip "carrier" (of either the "leaded" or "leadless" variety) which may conveniently include multiple lead frames, heat conductive members, strengthening members and the like. A window may be provided in the layers to provide a space for the chip. Also, metallic layers may also be provided to enhance performance of the package.
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