Method and apparatus for making electrical connections utilizing

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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427 46, 427 531, 427 88, 29851, B05D 512

Patent

active

046817786

ABSTRACT:
A method and apparatus for making electrical connections between conductors on a substrate utilizes a dielectric-like metal film deposited on the substrate interconnecting the conductors to be connected. The dielectric-like film is deposited in the form of microscopic islands or columns that are spaced by microscopic distances, thus making the film non-conductive when deposited. When an electrical connection is desired, the dielectric-like film is melted by localized heating, for example, by a focused laser, thereby melting the individual metal islands and permitting them to flow together to make the film conductive.

REFERENCES:
patent: 3801366 (1974-04-01), Lemelson
patent: 4159414 (1979-06-01), Suh
patent: 4480779 (1984-11-01), Luc
patent: 4486464 (1984-12-01), Young

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