Method and apparatus for making an electronic module for cards

Details Method and apparatus for making an electronic module for cards Method and apparatus for making an electronic module for cards

1994-08-10

1998-05-26

Picardat, Kevin

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

438125, 438127, H01L 2160

Patent

active

057563799

ABSTRACT:
A method of making an electronic module with an integrated circuit includes beginning with a standardized starting product in the form of an insulating substance bearing a conductive coating. Contact surfaces are formed in the conductive coating by interruptions in the insulating substance. Using milling cutter one provides the insulating layer of the starting product with variable patterns of recesses through which conductive connections between the contact surfaces and the integrated circuit are later guided. The position of the recesses is varied in accordance with the size of the integrated circuit to be incorporated in the electronic module.

REFERENCES:
patent: 4674175 (1987-06-01), Stampfli
patent: 5102828 (1992-04-01), Marchisi
patent: 5304513 (1994-04-01), Haghiri-Tehrani et al.

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