Method and apparatus for making a groove in a semi-conductor ele

Abrasive tool making process – material – or composition – With carbohydrate or reaction product thereof

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51 8R, 51319, B24C 104, B24C 322

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039539415

ABSTRACT:
A method and apparatus for forming a groove in a semiconductor element with at least two junctions between regions of alternating opposite conduction types and different doping concentrations and with the semiconducting region enclosed between the junctions exhibiting a higher resistivity than either of the neighboring regions, the lateral surface of the element between the surface edges of the junctions being sloped by means of a groove cut by sand blasting.

REFERENCES:
patent: 3262234 (1966-07-01), Roach
patent: 3570195 (1971-03-01), Otsuka
patent: 3589081 (1971-06-01), Kilischenko
patent: 3694972 (1972-10-01), Emeis
patent: 3824737 (1974-07-01), Janson

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