Method and apparatus for low temperature testing of electronic c

Details Method and apparatus for low temperature testing of electronic c Method and apparatus for low temperature testing of electronic c

1984-05-07

1986-08-19

Levy, Stewart J.

Electricity: measuring and testing

Measuring, testing, or sensing electricity, per se

With rotor

G01R 3126

Patent

active

046072209

ABSTRACT:
Apparatus for testing electronic components, such as integrated circuit chips, at a depressed temperature. The apparatus includes mounting structure for holding the electronic component to be tested and a heating and cooling stage positioned in heat transfer relationship with the component. Disposed on the mounting structure is an open top reservoir surrounding the electronic component and extending thereabove for holding sufficient liquid fluorocarbon to cover the component. The apparatus also includes probe means comprising porbes for making contact at predetermined locations on the top surface of the component. The probes are movable between respective first positions in substantial vertical alignment with their corresponding locations, but above the the liquid level of the reservoir, and respective second positions making contact at their corresponding locations whereby the component can be heated to drive off water vapor and, after addition of the fluid, the component can be cooled and tested without the formation of ice thereon. A method of testing electronic components at depressed temperatures is also set forth.

REFERENCES:
patent: 4026412 (1977-05-01), Henson
IBM Tech. Discl. Bull., Jameson, G., "Frost Free Cold Probe", vol. 13, No. 10, Mar. 1971, p. 3121.

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