Method and apparatus for low temperature integrated circuit chip

Details Method and apparatus for low temperature integrated circuit chip Method and apparatus for low temperature integrated circuit chip

1989-12-27

1991-07-02

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 82, 357 83, 357 87, 361382, 165 804, 324158T, 324158D, H01L 2302, H01L 2504

Patent

active

050289888

ABSTRACT:
Methods and apparatus for lowering integrated circuit (IC) chip ambient temperatures allow a slow IC chip to simulate a faster, functionally equivalent one for design testing purposes when the faster chip is not yet available. The cooling devices employed include a cryogenic chip cooling apparatus, and a novel thermo-electric chip cooling apparatus using a directly water-cooled Peltier effect device attached to the surface of the IC chip.

REFERENCES:
patent: 2758146 (1956-08-01), Lindenblad
patent: 2872788 (1959-02-01), Lindenblad
patent: 2994203 (1961-08-01), Lackey et al.
patent: 3400543 (1968-09-01), Ross
patent: 3406753 (1968-10-01), Habdas
patent: 3441812 (1969-04-01), DeBucs et al.
patent: 3481393 (1969-12-01), Chu
patent: 3602721 (1971-08-01), Nakamura et al.
patent: 3648167 (1972-03-01), Purdy et al.
patent: 3979671 (1976-09-01), Meeker et al.
patent: 4253515 (1981-03-01), Swiatosz
patent: 4279292 (1981-07-01), Swiatosz
patent: 4607220 (1986-08-01), Hollman
patent: 4628991 (1986-12-01), Hsiao et al.
patent: 4704872 (1987-11-01), Jones
patent: 4741385 (1988-05-01), Bergles et al.
patent: 4744220 (1988-05-01), Kerner et al.
patent: 4748495 (1988-05-01), Kucharek
patent: 4812733 (1989-03-01), Tobey
patent: 4862075 (1989-08-01), Choi et al.
Skobern, `Thermoelectrically cooled module`, IBM Tech. Dis. Bull.; vol. 27 No. 1A Jun. 1984 p. 30.
Rideout, `Close-cycle liquid nitrogen refrigeration system . . . ` IBM Tech. Dis. Bull.; vol. 18 No. 4 Sep. 1975; pp. 1226-1229.

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