Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2006-02-07
2006-02-07
King, Roy (Department: 1742)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S241000, C204S269000, C204S270000
Reexamination Certificate
active
06994776
ABSTRACT:
A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.
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Chen Lin-Lin
Dundas Curt
Graham Lyndon W.
Ritzdorf Thomas L.
Stevens E. Henry
King Roy
Leader William T.
Semitool Inc.
Wallenstein Wagner & Rockey Ltd.
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