Method and apparatus for low angle, high resolution surface insp

Details Method and apparatus for low angle, high resolution surface insp Method and apparatus for low angle, high resolution surface insp

1989-05-19

1992-07-07

Rosenberger, Richard A.

Optics: measuring and testing

Inspection of flaws or impurities

Having predetermined light transmission regions

250563, 250572, G01N 2188

Patent

active

051277263

ABSTRACT:
The invention relates to an inspection system for inspecting the surfaces of wafers, LCD's and film substrates for flaws. The system includes a scanning laser inspection system for quickly inspecting the surface and identifying and locating the flaws. The system generates and displays a flaw map graphically illustrating the article surface and the respective locations of the flaws for subsequent optical inspection. The operator selects a flaw and an optical inspection system is positioned over the selected flaw to provide a magnified image of the flaw. The operator may optically inspect all or any number of the flaws. The invention also includes means for spectrometrically analyzing the reflected light to further identify the flaw.

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Surfscan.RTM. Patterned Wafer Contamination Analyzer, Tencor Instruments, Printed Aug. 1988.
Hitachi Electronics Engineering Co., Ltd. brochure entitled "Patterned Wafer Inspection System HILIS-200".

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