Method and apparatus for locating, inspecting, and placing large

Details Method and apparatus for locating, inspecting, and placing large Method and apparatus for locating, inspecting, and placing large

1996-10-02

1998-09-08

Boudreau, Leo

Image analysis

Applications

Manufacturing or product inspection

382168, G06K 900

Patent

active

058057226

ABSTRACT:
In a machine vision system capable of capturing an optical image of a semiconductor electronic component part and digitizing the optical image, a method for locating, inspecting and placing parts known as large leaded devices, by estimating a part's location; estimating the approximate location of a group of leads; computing the center and angle of a lead scan search rectangle within which the leads in a group of leads must be located; scanning a lead scan search rectangle to locate lead edges and compile a list of edges; extracting lead positions; updating the part location estimate; and repeating these steps for each lead set to find all leads and lead centerlines; then calculating an optimal part position estimate by matching found lead positions with expected lead centerlines; and finally, inspecting the leads. A statistical lead rejection procedure is included during lead extraction.

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