Method and apparatus for locating conductive features and testin

Details Method and apparatus for locating conductive features and testin Method and apparatus for locating conductive features and testin

1994-10-03

1996-08-06

Wieder, Kenneth A.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324 725, 3241581, G01R 104

Patent

active

055437249

ABSTRACT:
A system for locating electrically conductive features such as device terminals (104) of a semiconductor die device under test (103) includes an array of test terminals (101), an anisotropically conductive material (102) above the array of test terminals (101), and a semiconductor die (103). The array of test terminals has a pitch (203) much smaller than the pitch (204) of the device terminals (104). Individual test terminals (105) of the array of test terminals (101) are scanned to locate the device terminals (104). Once the device terminals (104) are located, the test terminals (105) are configured to send and receive functional signals required for functionally testing the device under test (103).

REFERENCES:
patent: 3806800 (1974-04-01), Boue
patent: 4477774 (1984-10-01), Revirieux
patent: 4870356 (1989-09-01), Tingley
patent: 5367253 (1994-11-01), Wood
Grove, Z-Axis Adhesive Film: Innovation in Electronic Interconnection, Interconnection Technology, Dec. 1992, p. 35.
Hogerton, Development Goals and Present Status of 3M's Adhesive Interconnection Technology, Journal of Electronics Manufacturing (1993) 3, 191-197.

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