Method and apparatus for locating and/or forming bumps

Details Method and apparatus for locating and/or forming bumps Method and apparatus for locating and/or forming bumps

2006-05-10

2008-12-23

Dang, Phuc T (Department: 2892)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S107000, C257S777000

Reexamination Certificate

active

07468291

ABSTRACT:
A method for locating, forming, or both locating and forming, bumps of material on a substrate having a plurality of devices, the method includes receiving data which indicates the number and location of the devices on the substrate, then using a flip-chip bumping apparatus to locate, form, or both locate and form, bumps of material on the devices, the positions of the devices being determined using the data.

REFERENCES:
patent: 7166925 (2007-01-01), Akram
patent: 2007/0070311 (2007-03-01), Bijnen et al.

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