Method and apparatus for leak checking unpackaged semiconductor

Details Method and apparatus for leak checking unpackaged semiconductor Method and apparatus for leak checking unpackaged semiconductor

1997-07-07

1998-02-24

Nguyen, Vinh P.

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

324755, G01R 3102

Patent

active

057214964

ABSTRACT:
A method and apparatus for testing an unpackaged semiconductor die for pad leakage current are provided. The method includes: providing a temporary package for a single unpackaged die; assembling the temporary package with the die; placing the package in electrical communication with leak checking circuitry; and then detecting for leakage current. The leak checking circuitry is adapted to apply a voltage through external leads on the temporary package to a pad of the die (e.g., input/output pad). The leak checking circuitry then detects any resultant leakage current from the pad to the substrate, or to a second pad for the die (e.g., V.sub.DD pad, V.sub.CC pad, power pad).

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