Method and apparatus for laying wire arrays

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156439, B65H 8100

Patent

active

045884625

ABSTRACT:
Wire arrays (11) having a continuous wire (12) which is formed into a predetermined pattern and adhered to a backing material or substrate (13) are fabricated by applying adhesive material (16a, 16b) along opposite edge portions (17, 18) of the substrate, positioning a row of winding spools (21) along each of the edge portions and repeatedly extending the wire between and around successive spools at the opposite edge portions. The wound wire is then traveled along each spool toward the substrate and into contact with the adhesive. The spools are then removed and a coating of hardenable material (54) is applied to secure the wound wire to the substrate. Tension in the wire is relieved prior to contact of the wire with the adhesive and a small amount of slack is introduced into the wire before the final coating step. Mechanism (32) is provided for lifting the spools away from the substrate without disturbing the wound wire. The method and apparatus enable manufacture of precisely configured wire arrays without complex or costly equipment and do not require structural alterations in the substrate for the purpose of accommodating to fabrication equipment.

REFERENCES:
patent: Re26374 (1968-04-01), Beery
patent: 1376987 (1921-05-01), Wirt
patent: 2836287 (1958-05-01), Cady
patent: 2962080 (1960-11-01), Hirch
patent: 3010007 (1961-11-01), Theodore et al.
patent: 3185184 (1965-05-01), Loy et al.
patent: 3298403 (1967-01-01), Allers
patent: 3574927 (1971-04-01), Whetstone
patent: 3964959 (1976-06-01), Adams
patent: 4347873 (1982-09-01), Caras

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