Method and apparatus for laser processing a target material to p

Details Method and apparatus for laser processing a target material to p Method and apparatus for laser processing a target material to p

1989-10-20

1991-10-15

Albritton, C. L.

Electric heating

Metal heating

By arc

21912172, B23K 2600

Patent

active

050576640

ABSTRACT:
A diode-pumped laser system (10) incorporates a polarization state control device (12) that provides a trim profile (84) having minimal striations (64) on a target material (42). The striations run generally parallel to the polarization direction of laser output light beam (L) and are diminished whenever the polarization direction is parallel to the laser trimming direction. The striations are substantially eliminated by circularly or randomly polarizing the laser output light beam.

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Boyd et al., "Various Phase Transitions and Changes in Surface Morphology of Crystalline Silicon Induced by 4-260-ps Pulses of 1-m Radiation", Appl. Phys. Lett., vol. 45, No. 1, pp. 80-82, (Jul. 1, 1984).
Ehrlich et al., "Time-Resolved Measurements of Stimulated Surface Polariton Wave Scattering and Grating Formation in Pulsed-Laser-Annealed Germanium", Appl. Phys. Lett., vol. 41, No. 7, pp. 630-632, (Oct. 1, 1982).

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