Method and apparatus for laser processing

Details Method and apparatus for laser processing Method and apparatus for laser processing

2006-05-02

2010-11-16

Evans, Geoffrey S (Department: 3742)

Electric heating

Metal heating

By arc

C219S121820

Reexamination Certificate

active

07834293

ABSTRACT:
A method and an apparatus for processing workpieces with a laser beam include first and second stages for holding the workpieces and first and second laser beam paths. The first workpiece is loaded upon the first stage, aligned with the first laser beam path, and processing begun. While the first workpiece is aligned in relation to the first laser beam path, the second workpiece is prepared in relation to the second laser beam path. Processing of the second workpiece is begun as soon as the laser beam is available for processing.

REFERENCES:
patent: 4708545 (1987-11-01), Fujii et al.
patent: 4873417 (1989-10-01), Moriyasu et al.
patent: 5111406 (1992-05-01), Zachman et al.
patent: 5690846 (1997-11-01), Okada et al.
patent: 5948291 (1999-09-01), Neylan et al.
patent: 6201214 (2001-03-01), Duffin
patent: 6340806 (2002-01-01), Smart et al.
patent: 6580054 (2003-06-01), Liu et al.
patent: 6610961 (2003-08-01), Cheng
patent: 7132622 (2006-11-01), Ito et al.
patent: 7329830 (2008-02-01), Baudron et al.
patent: 2003/0178398 (2003-09-01), Nagatoshi et al.
patent: 2004/0105092 (2004-06-01), Iwata
patent: 2005/0205778 (2005-09-01), Kitai et al.
patent: 2006/0138097 (2006-06-01), Hiramatsu
patent: 927597 (1999-07-01), None
patent: 61-172003 (1986-08-01), None
patent: 6-20899 (1994-01-01), None
patent: 7-171796 (1995-07-01), None
patent: 5-57874 (1998-03-01), None
patent: 10-58173 (1998-03-01), None
patent: 2002-283074 (2002-10-01), None
patent: 2002-283074 (2002-10-01), None
patent: 2003-112278 (2003-04-01), None
patent: 2003-340586 (2003-12-01), None
patent: WO-96/11769 (1996-04-01), None
Written Opinion of the International Searching Authority for PCT/US2007/067945, dated Oct. 1, 2007, 4 pages.

Affiliated with

Also associated with

Rating

Method and apparatus for laser processing does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method and apparatus for laser processing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method and apparatus for laser processing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4242330