Method and apparatus for laser diode assembly and array

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor

Reexamination Certificate

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Details

C438S026000, C438S027000, C438S107000, C438S109000, C438S117000

Reexamination Certificate

active

06927086

ABSTRACT:
A method and apparatus for assembling laser diode arrays. The invention includes the use of vacuum forces and a bi-metallic clip to place a diode array and substrate in proper alignment, and to maintain that alignment while solder pre-forms are melted in an oven to accomplish a mass fusion of the assembly.

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