Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Packaging or treatment of packaged semiconductor
Reexamination Certificate
2005-08-09
2005-08-09
Wilson, Christian (Department: 2891)
Semiconductor device manufacturing: process
Making device or circuit emissive of nonelectrical signal
Packaging or treatment of packaged semiconductor
C438S026000, C438S027000, C438S107000, C438S109000, C438S117000
Reexamination Certificate
active
06927086
ABSTRACT:
A method and apparatus for assembling laser diode arrays. The invention includes the use of vacuum forces and a bi-metallic clip to place a diode array and substrate in proper alignment, and to maintain that alignment while solder pre-forms are melted in an oven to accomplish a mass fusion of the assembly.
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Baker Rod D.
Decade Products, Inc.
Peacock & Myers, P.C.
Wilson Christian
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