Method and apparatus for large-area electrical contacting of a s

Details Method and apparatus for large-area electrical contacting of a s Method and apparatus for large-area electrical contacting of a s

1990-05-22

1993-05-11

Niebling, John

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Utilizing electromagnetic wave energy during coating

205123, 204130, 204242, 204252, 2041293, 437 19, G01R 3126

Patent

active

052098338

ABSTRACT:
A semiconductor crystal wafer is fixed between two electrolyte-filled cells so that the front surface and rear surface thereof are respectively in contact with an electrolyte. A respective electrode is located in the electrolyte, a DC voltage being applied between these electrodes so that the semiconductor-to-electrolyte contact of the one cell is polarized in the conducting direction and the other is polarized in the non-conducting direction. A current flow through the semiconductor crystal body is enabled in that the inhibiting surface of the semiconductor crystal is illuminated and charge carriers are generated as a result thereof. On the basis of the selection of suitable electrolytes and the intensity of illumination, high current density is possible even given high-impedance semiconductor crystal wafers as well as semiconductor crystal bodies having doping steps or pn junctions. The method is particularly simple in many semiconductor processing and analyses methods.

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