Method and apparatus for lapping or polishing materials

Details Method and apparatus for lapping or polishing materials Method and apparatus for lapping or polishing materials

1977-01-27

1978-08-01

Klein, David

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29423, 29424, 51216R, 51277, 156154, 156309, 156247, 156344, 156299, 269321WE, B32B 3100

Patent

active

041040996

ABSTRACT:
Wafers to be processed are mounted to a lapping plate of a lapping machine using a photosensitive thermoplastic material, such as a photoresist. In a preferred embodiment, the wafers are laminated to a dry film photopolymer disposed on a carrier sheet, after which the sheet is secured to the lapping plate using a pressed-fit hoop that stretches the carrier sheet across the surface of the lapping plate and holds the sheet secure about the perimeter of the plate.

REFERENCES:
patent: 3078559 (1963-02-01), Thomas
patent: 3475867 (1969-11-01), Walsh
patent: 3562057 (1971-02-01), McAlister et al.
patent: 3663326 (1972-05-01), Wanesky
patent: 3809050 (1974-05-01), Chough et al.
patent: 3970494 (1976-07-01), Pritchard

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