Method and apparatus for joining substrates

Details Method and apparatus for joining substrates Method and apparatus for joining substrates

2006-03-07

2006-03-07

Haran, John T. (Department: 1733)

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

C156S286000, C156S381000, C156S382000, C156S538000

Reexamination Certificate

active

07008502

ABSTRACT:
In order to reduce cycle times for assembling at least two substrates (3,4) in order to form an optical data carrier in a low-pressure chamber (8), a method and a device are disclosed wherein an opening (11) of the low-pressure chamber is sealed in relation to the surrounding environment, the low-pressure chamber is pumped out, a transfer chamber (64) is formed between a first handling device (16) arranged in the low-pressure chamber and a second handling device (24) arranged outside the low-pressure chamber by respectively sealing the opening (11) of the low-pressure chamber (8). The transfer chamber (64) has a smaller volume than that of the low-pressure chamber (8); the substrates (3, 4) in the transfer chamber (64) are transferred from the second handling device (24) to the first handling device (16); the substrates are conveyed (3, 4) with the first handling device (16) to an assembly station (14) in the low-pressure chamber when low-pressure chamber is sealed by the second handling device (24), and the substrates (3,4) are assembled in the assembly station (14).

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