Electrical connectors – With coupling movement-actuating means or retaining means in... – Coupling part for receiving edge of planar board moving...
Reexamination Certificate
1997-07-21
2001-05-22
Vu, Hien (Department: 2833)
Electrical connectors
With coupling movement-actuating means or retaining means in...
Coupling part for receiving edge of planar board moving...
C439S496000
Reexamination Certificate
active
06234820
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates to printed circuit boards, and more specifically, to joining printed circuit boards.
BACKGROUND OF THE INVENTION
Printed circuit boards are joined together in order to form a larger board. Joining printed circuit boards may be advantageous, for example, to join because different printed circuit boards, manufactured by different manufacturers and serving different functions. Additionally, printed circuit board size is limited, and by joining together printed circuit boards, larger boards may be formed.
One prior art method of joining printed circuit boards is using stamped metal leads. Stamped metal leads are soldered to traces on one of the printed circuit boards to be joined together. These stamped metal leads provide the spring force needed to establish electrical contact. A standard connection may require up to 50 grams (g) of force on each metal lead. For a 64 metal lead printed circuit board, this would be 50 g * 64=3200 g=3.2 kg=7.04 pounds. Therefore, the stamped metal leads have to provide sufficient spring force to provide such pressure. Typically, stamped metal contacts increase metal lead length in order to provide the required spring force. When the daughter board is coupled to the mother board, the metal contacts are first wiped, and then coupled together. Generally the stamped metal contacts are soldered. In this way a secure connection is established.
This method has numerous disadvantages. Usually the boards can only be attached end to end. The connection is not easily disconnected. The initial wiping required makes these boards not field replaceable. Gold leads are expensive, but are used because other metals do not provide sufficient spring force. The length of the stamped metal contacts is determined by the spring force needed. Since the metal contacts provide the spring force, the impedance and inductance of the spring metal contacts is not controlled.
SUMMARY AND OBJECTS OF THE INVENTION
It is an object of this invention to provide for a low cost separable interconnect between printed circuit boards.
It is a further object of this invention to provide a controlled impedance connection between printed circuit boards.
It is a further object of this invention to provide a low inductance connection between printed circuit boards.
It is an object of this invention to provide for a method of joining printed circuit boards which provides a wipe.
The present invention includes a mother board which has a socket. The present invention further includes a daughter board which has a connector. The traces on the daughter board are connected to signal leads, which are wrapped around an elastomer. The mother board is coupled to a daughter board when the connector is engaged with the socket, and the traces on the mother board are coupled to the signal leads of the daughter board.
Other objects, features, and advantages of the present invention will be apparent from the accompanying drawings and from the detailed description that follows below.
REFERENCES:
patent: 3082398 (1963-03-01), Valach
patent: 3114587 (1963-12-01), Herrmann
patent: 3701071 (1972-10-01), Landman
patent: 3874768 (1975-04-01), Cutchaw
patent: 4426689 (1984-01-01), Henle et al.
patent: 4586764 (1986-05-01), Mullen, III et al.
patent: 4598962 (1986-07-01), Reitz et al.
patent: 4636022 (1987-01-01), Sonobe
patent: 4678252 (1987-07-01), Moore
patent: 4714435 (1987-12-01), Stipanuk et al.
patent: 4795079 (1989-01-01), Yamada
patent: 4798541 (1989-01-01), Porter
patent: 4850892 (1989-07-01), Clayton et al.
patent: 4885126 (1989-12-01), Polonio
patent: 4891023 (1990-01-01), Lopata
patent: 4939570 (1990-07-01), Bickford et al.
patent: 4967262 (1990-10-01), Farnsworth
patent: 4975763 (1990-12-01), Baudouin et al.
patent: 5002494 (1991-03-01), Olsson
patent: 5026297 (1991-06-01), Krehbiel
patent: 5051366 (1991-09-01), Anderson et al.
patent: 5104324 (1992-04-01), Grabbe et al.
patent: 5229916 (1993-07-01), Frankeny et al.
patent: 5260601 (1993-11-01), Baudouin et al.
patent: 5278724 (1994-01-01), Angulas et al.
patent: 5337220 (1994-08-01), Granitz
patent: 5432678 (1995-07-01), Russell et al.
patent: 5482474 (1996-01-01), Yohn et al.
patent: 5568363 (1996-10-01), Kitahara
patent: 5569045 (1996-10-01), Hsu
patent: 5610642 (1997-03-01), Nobel
patent: 5633533 (1997-05-01), Andros et al.
patent: 5673479 (1997-10-01), Hawthorne et al.
patent: 5748209 (1998-05-01), Chapman
patent: 5790380 (1998-08-01), Frankeny
patent: 5903292 (1999-05-01), Scheffelin et al.
patent: 3-611346 (1987-10-01), None
patent: 0 226 276 (1987-06-01), None
patent: 0 472 203 (1992-02-01), None
patent: 0 542 433 (1993-05-01), None
patent: 2 109 444 (1972-05-01), None
patent: 55-138264 (1980-10-01), None
patent: 59-312217 (1984-07-01), None
patent: 59-130453 (1984-07-01), None
patent: 1-166545 (1989-06-01), None
patent: 10-150065 (1998-02-01), None
patent: 9318559 (1993-09-01), None
European Search Report, 1 page.
“Chip to Package Interconnections”, chapter form book: Optoelectric Interconnections, pp. 436, 437 & 463.
Terry Cosslouc, Connector Combines Metal With Elastomers, 1 page.
R. Cook, “More Memory In Less Space”, Byte Magazine, pp. 197, 198, 200 (Jun. 1995).
D, Brearkey, Jr., “Assuming Reliability Of Surface Mounted Connectors”, National Electronic Packaging and Production Conference, pp. 606-614 (Feb. 25-27, 1986).
D, Brearky, Jr., “The Connector/PCB Interface Key to Success In Surface Mounting Of Connectors”, N.E.P. and Production Conference, pp. 427-434 (Feb. 25-27, 1986).
M.A. Choudhury, “Fasteners Take On New Shapes”, Electronic Packaging & Production, pp. 58-59, (May 1986).
R. P. Goel, “Greater Packaging Density Through Direct Surface Mounting Of Components”, pp. 17-20 (Dec. 1986).
N. Janota, et al,, “The Connectorization Of Surface-Mount PC Boards”, Design News, pp. 88-90 (Jun. 16, 1986).
D. L. Timmins, “An Elastomeric Interconnect System For Fine Pitch Leadless Chip Carriers, ” IEEE 34th Electronic Components Conference, pp. 138-143 (May 14-16, 1984).
M. Gates, “Supporting The Surface Mounting Switchover”, New Electronics, pp. 63, 65, 67 (Jun. 26, 1984).
PCT International Search Report, International Application No. PCT/US98/15056, filed Jul. 21, 1998, mailed Jan. 25, 1999, 5 pages.
IBM Technical Disclosure Bulletin “Inexpensive Chip Package”, vol. 33, No. 1A, pp. 272 & 273.
Written Opinion PCT/US98/15056, 5 pages.
Dillon John B.
Dillon Nancy David
Perino Donald V.
Blakely , Sokoloff, Taylor & Zafman LLP
Dillon Nancy David
Rambus Inc.
Vu Hien
LandOfFree
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