Method and apparatus for joining adhesive tape to back face...

Details Method and apparatus for joining adhesive tape to back face... Method and apparatus for joining adhesive tape to back face...

2006-07-25

2006-07-25

Purvis, Sue A. (Department: 1734)

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With work feeding or handling means

C156S556000, C156S558000, C438S464000, C438S976000

Reexamination Certificate

active

07080675

ABSTRACT:
In a method for joining an adhesive tape to a back face of a semiconductor wafer after a process of working the back face of the semiconductor wafer, the semiconductor wafer is held at a state where a face having a pattern formed thereon is directed upward, and the adhesive tape is joined to the back face of the semiconductor wafer from below.

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patent: 62174940 (1987-07-01), None
patent: 10-189693 (1998-07-01), None
patent: 2001284434 (2001-10-01), None
patent: WO 2002102625 (2002-12-01), None

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