Method and apparatus for interfacing between automatic wafer pro

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

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Details

324754, 324758, G01R 3102, G01R 3126

Patent

active

061148695

ABSTRACT:
A system for interfacing between a semiconductor wafer, an automatic wafer probe machine, and an automatic IC test system includes an insert ring adapted for attachment to a support of the wafer probe machines. A lock ring assembly includes a lock ring rotatably disposed in the insert ring. A cam element having a sloped camming surface is attached to the lock ring. A retaining element attached to the insert ring retains the lock ring in the insert ring. A lid hingeably attached to the insert ring supports a POGO tower assembly including an adapter ring for attachment to a POGO tower and a z-axis ring attached to the adapter ring, and a mounting assembly connecting the z-axis ring in spring-loaded relationship to the lid. A cam follower attached to the z-axis ring engages the sloped camming surface when the lid is lowered to position a bottom surface of the POGO tower slightly above the probe card. The cam follower follows the camming surface lower as the lock ring is rotated to force POGO pins at the bottom of the POGO tower against contact pads of the probe card.

REFERENCES:
patent: 5489853 (1996-02-01), Nakajima
patent: 5923180 (1999-07-01), Botka et al.

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