Method and apparatus for interconnection of modular electronic c

Details Method and apparatus for interconnection of modular electronic c Method and apparatus for interconnection of modular electronic c

1997-11-14

1999-11-16

Donovan, Lincoln

Electrical connectors

With insulation other than conductor sheath

Plural-contact coupling part

H01R 13514

Patent

active

059847328

ABSTRACT:
A method and an apparatus for interconnection of modular electronic components are provided. At least one foot is located on the bottom side of a component for providing mechanical support to the component. At least one receptacle is located on the top side of the component. The size and number of the receptacles correspond to the size and number of the feet. The feet contain at least one electrical connector. When multiple components are stacked, the receptacles of the lower component accept the corresponding feet and electrical connectors of the upper component thereby forming an electrical connection. The modular electronic components comprise computer components and stereo system components. The electrical connections comprise power connections and signaling connections.

REFERENCES:
patent: 3340439 (1967-09-01), Henschen et al.
patent: 4733461 (1988-03-01), Nakano
patent: 5676553 (1997-10-01), Leung
patent: 5825627 (1998-10-01), Tamura

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